한국표면공학회지 (33권2호 69-76)
Characterization and Construction of Chemical Vapor Deposition by using Plasma
rf 플라즈마 화학기상증착기의 제작 및 특성
김경례;김용진;현준원;이기호;노승정;최병구;
단국대학교 자연과학부 응용물리전공;단국대학교 사범학부 과학교육전공;
The rf plasma chemical vapor deposition is a common method employed for diamond or amorphous carbon deposition. Diamond possesses the strongest bonding, as exemplified by a number of unique properties-extraordinary hardness, high thermal conductivity, and a high melting tempera tore. Therefore, it is very important to investigate the synthesis of semiconducting diamond and its use as semiconductor devices. An inductively coupled rf plasma CVD system for producing amorphous carbon films were developed. Uniform temperature and concentration profiles are requisites for the deposition of high quality large-area films. The system consists of rf matching network, deposition chamber, pumping lines for gas system. Gas mixtures with methane, and hydrogen have been used and Si (100) wafers used as a substrate. Amorphous carbon films were deposited with methane concentration of 1.5% at the process pressure of S torr~20 torr, and process temperature of about