Korean Institute of Surface Engineering

pISSN : 1225-8024 | eISSN : 3399-8403

공학

한국표면공학회지 (32권4호 503-512)

The TEM Characterization of the Interfacial Microstructure between In Solder and Au/Ni/Ti Thin Films during Reflow Process

리플로 공정 후에 형성된 In과 Au/Ni/Ti 다층 박막의 계면 구조의 TEM 분석

조원구;김영호;김창경;

한양대학교 공과대학 재료공학부;

Abstract

The crystal structure and the microstructure of the intermetallic compounds formed in the interface between In solder and Au/Ni/Ti thin films have been investigated by XRD, SEM, and TEM. Indium solder was deposited on the Au/Ni/Ti thin films/Si substrate by evaporation. The heat treatments simulated the flip chip solder joining were performed in RTA system or in furnace. $Auln_2$ phase is formed in all specimens.$ In_{27}$ $Ni_{10}$ and/or $In_{X}$ $Ni_{Y}$ phase are formed in the interface between $Auln_2$ and Ni depending the heat treatment conditions.

Keywords