한국표면공학회지 (32권3호 372-376)
CRYSTAL ORIENTATION OF ELECTROLESS COPPER AND ELECTRODEPOSITED NICKEL FILMS ON THE MAGNETS
Chiba, Atsushi;Kobayashi, Katsuyoshi;Miyazaki, Hiroki.;Yoshihara, Sachio;Wu, Wen-Chang;
Department of Materials Chemistry, Yokohama National University;Department of Industrial Chemistry, Utsunomiya University;Department of Chemical Engineering, Nan-Tai, Institute of Technology.;
The deposited Cu film on the ferrite magnet was more deposited comparing with that on the plastic magnet. The Cu film became thicker on the S pole comparing with that on the N pole in the both of magnets. The thickness and texture coefficient of deposited copper film affected with direction of line of magnetic force. The difference of pole had little or no effect to the texture coefficient of deposited nickel film. The reaction rate on ferrite magnet and S pole was faster comparing with that on plastic magnet and N pole.
Cu electroless plating;Ni electroplating;Crystal orientation;Magnet;
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