Korean Institute of Surface Engineering

pISSN : 1225-8024 | eISSN : 3399-8403

공학

한국표면공학회지 (32권3호 214-218)

THE EFFECTS OF ADDITIVES IN NICKEL AND COPPER ELECTROPLATING FOR MICROSTRUCTURE FABRICATION


Kim, Go-Eun;Lee, Jae-Ho;


Dept. of Metallurgical Engineering and Materials Science Hongik University;

Abstract

The effect of additives in nickel and copper electroplating were investigated for MEMS applications. Saccharin and gelatin were used as additives in nickel and copper electroplating bath respectively. The morphology and surface hardness of electroplated coating were investigated with additive concentration. Microstructures were fabricated with optimum conditions.

Keywords

Electroplating;Nickel;Copper;MEMS;Saccharin;Gelatin;