Korean Institute of Surface Engineering

pISSN : 1225-8024 | eISSN : 3399-8403

공학

한국표면공학회지 (32권3호 211-213)

Pb-FREE SOLDER PLATING


Yada, Y.;Tokio, K.;


2nd Development Department, Research Center, Ebara-Udylite Co., Ltd.;

Abstract

In the future, restrictions are likely to be imposed on the use of lead in the electronics industry. In dealing with such a move, we have been developing Pb-free Sn-Ag plating process to replace presently available Sn-Pb process. In this paper, the result of a basic comparison test between Sn-Pb plating and Sn-Ag plating is reported.

Keywords

Pb-free;Sn-Ag;Meling point;Solderability;Environment-free;