한국표면공학회지 (29권6호 760-765)
LOW TEMPERATURE DEPOSITION OFSIOx FILMS BY PLASMA-ENHANCED CVD USING 100 kHz GENERATOR
Kakinoki, Nobuyuki;Suzuki, Takenobu;Takai, Osamu;
Department of Materials Processing Engineering, Nagoya University;
Silicon oxide thin films are prepared by plasma-enhanced CVD (PECVD) using 100kHz and 13.56MHz generators. Source gases are two sorts of mixture, tetramethoxysilane (TMOS) and oxygen, and tetramethylsilane (TMS) and oxygen. We investigate the effect of frequency on film properties of deposited films including mechanical properties. 100kHz PECVD process can deposit silicon oxide films at