Korean Institute of Surface Engineering

pISSN : 1225-8024 | eISSN : 3399-8403


공학

한국표면공학회지 (29권6호 709-713)

PREPARATION OF ANISOTROPIC CONDUCTIVE FINE PARTICLES BY ELECTROLESS NICKEL PLATING.


Fujinami, T.;Watanabe, J.;Motizuki, I.;Honma, H.;


Faculty of Engineering Kanto Gakuin University;

Abstract

Mechanical solderless chip packaging with small gold bumps or metal balls has increased in the electronic devices. The preparation of conductive particles (5~7 $mu extrm{m}$ diamiter) by electroless nickel plating have been investigated. Generally, batch type electroless plating is applied to provide conductivity on the nonconductors. Since the surface areas of particles are much larger than the bulk substrate, accordingly the electroless plating bath becomes unstable. Thus, we applied the continuous dropping method for the preparation of conductive particles. The uniform coverage of deposited nickel on the particles was obtained by using ammonium acetate as a complexing agent, and surface coverage is further improved without coagulation of particles by the surface active agent treatment before enter the plating bath.

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