한국표면공학회지 (29권3호 186-194)
Adhesion characteristics of copper layer fabricated by Sol-Gel process
Sol-Gel법을 이용한 알루미나 기판과 동 피복층간의 접착력 특성
김동규;이홍로;
충남대학교 공과대학 금속공학과;
In this study, ceramic film was coated by a sol-gel process for increasing the adhesion strength between the substrate and copper layer. TEOS and ATSB were used as starting solution of metallic alkoxide. As a result, amorphous-like diffraction pattern after heat treatment at