한국표면공학회지 (26권6호 327-333)
Adhesion between Cu-18wt% Cr Alloy Film and Polyimide : Effect of Heat Treatment
Cu-18wt% Cr 합금박막과 폴리이미드사이의 접착력 : 열처리 영향
임준홍;김영호;한승희;
한양대학교 재료공학과;한국과학기술연구원;
The effect of heat treatment on the adhesion between Cu-18wt% Cr film and polyimide has been studied by using T-peel test, AES, and XRD. Cu-18wt% Cr alloy and pure Cu films were sputter deposited onto pol-yimide. Cu was electroplated before and after heat treatment at