저널

The effects of surfactants on electorless copper plating bath for PCB was studied. Basic bath composition was cuplic sulfate 10g/l, EDTA.2Na 40 g/l, formalin$ 3mell$/l and sodium hydroxide solution for pH adjust. After addition of accelerators, stabilizers and surfactants, the polarization curves in plating bath were carried out for presumption of the plating rate. From the plating rate in bath with the various concentration of additives, the optimum condition for manufacturing the electroless copper plating bath was confirmed. It was found that the addition of $alpha$.$alpha$`-dipyridyl, pyridine and polyxyethylene octylphenylether was good as stabilizer, accelerator and surfactants, respectively. With this additives, the maximum plating rate of $12mu extrm{m}$/h at $65^{circ}C$ and $2mu extrm{m}$/h at $25^{circ}C$ was obtained.