한국표면공학회지 (25권2호 90-96)
Microsturctures of copper thin films sputtered onto polyimide
폴리이미드 위에 스퍼터 증착된 구리 박막의 미세구조
정태경;김영호;유진;
Chung, Tae-Gyeong;Kim, Young-Ho;Yu, Jin;
한국과학기술원 전자재료공학과;한양대학교 재료공학과;
Dept. of electronic materials science and engineering, KAIST;Dept. of materials engineering, Hanyang university;
Thed effects of sputter gas pressure and substrate surface micro-roughness on the microstructure and surface topography have been investigated in the Cu thin films sputter deposited onto polyimide substrates. The surface roughness of polyimide was controlled by oxygen rf plasma treatment. In the Cu film deposited at the pressure of 5 mtorr, the surface is smooth and the columnar structure is not visible regardless of polyimide surface more open boundaries. The polyimide surface roughness enhances these effects, These phenomena can be explained in therm of atomic shadowing effect.