한국표면공학회지 (23권3호 144-149)
Behavior of Tin and Palladium for Electroless Plating on bariumtitanate ceramics.(Part 1:Study with Electron Spertroscopy for Chemical Analysis)
티탄산바륨세라믹의 무전해도금을 위한 Sn 및 Pb 촉매의 거동 (제1부: Electron Spertroscopy for Chemical Analysis에 의한 연구)
박광자;
국립공업시험원;
X-ray phtoelectron spectroscopy has been used to obtain information on the behavior of the Pb catalysis and Sn sensitizer on the bariumtitanate ceramic substrate. SnF2 sensitization and PbCl2 activation process are used are used to prepare nonconductive substrate for electroless plating. This method of surface preparation is compared to Pd-Sn mixed solu tions and Ag pretreatment process. In all the case, the bonding energy is about 487.5eV for Sn and 336.5~337.5eV for Pb.
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