한국표면공학회지 (18권3호 95-104)
Preferred Orientation, Microstructure, Surface Morphology and Mechanical Properties of Electrodeposited Copper Foils
電解銅薄의 優先方位, 斷面組織, 表面形態 및 機械的 性質
김윤근;이동녕;
Kim, Yoon-Keun;Lee, Dong-Nyung;
서울대학교 공과대학 금속공학과;
Department of Metallurgical Engineering Seoul National University;
A study has been made of preferred orientation, crose sectional microstructure, surface morphology and mechanical properties of copper foils fabricated by electrodeposition on 304 stainless steel plate from copper sulfate baths for high speed plating. The preferred orientation of the copper foils changed from the [110] to the [111] to ture with decreasing bath temperature and increasing cathode current density. The foils with the [110] texture had the field oriented texture type structure and the surface of many asperities grooved approximately perpendicular to the subtrate. A specimen with the [111]+[311] texture had the lower strength than one with the [10] texture, if they were obtained under similar electrolysis conditions.