한국표면공학회지 (56권1호 77-83)
Electrolytic silane deposition to improve the interfacial adhesion Ag and epoxy substrate
Ag/에폭시간 계면 접착력 향상을 위한 전해 실란 처리
공원효a,b, 박광렬c, 류호준c, 배인섭c, 강성일c, 최승회a,*
Wonhyo Konga,b, Gwangryeol Parkc, Hojun Ryuc, Sung-il Kangc, Inseob Baec, Seunghoe Choea,*
a한국재료연구원, b부산대학교 재료공학과, c해성DS 주식회사
aSurface & Nano Materials Division, Korea Institute of Materials Science (KIMS), 797 Changwondaero, Seongsan-gu, Changwon, Gyeongsangnam-do, 51508, Republic of Korea bDepartment of Materials Science and Engineering, Pusan National University, Busan, 46241, Republic of Korea cHaesung DS, 726, Ungnam-ro, Seongsan-gu, Changwon, Gyeongsangnam-do, 51552, Republic of Korea
The reliability of leadframe-based semiconductor package depends on the adhesion between metal and epoxy molding compound (EMC). In this study, the Ag surface was electrochemically treated in a solution containing silanes in order to improve the adhesion between Ag and epoxy substrate. After electrochemical treatment, the thin silane layer was deposited on the Ag surface, whereby the peel strength between Ag and epoxy substrate was clearly improved. The improvement of peel strength depended on the functional group of silane, implying the chemical linkage between Ag and epoxy.
Adhesion promoter; silane; electrolytic treatment; leadframe; semiconductor package.
PDF