Korean Institute of Surface Engineering

pISSN : 1225-8024 | eISSN : 3399-8403


공학

한국표면공학회지 (54권3호 158-163)

Introduction of Selective Electrochemical Additive Manufacturing Technology and Consideration of Integration Method for PCB Mass Production Process

선택적 전기화학 3D 프린터 기술 소개 및 PCB 양산공정 적용방식 고찰

김성빈1,*, 유봉영2
Sung-Bin Kim1,* and Bongyoung Yoo2

1애니캐스팅, 2한양대학교 재료화학공학과
1AnyCasting Co., Ltd., B-16th FL., Woolim BLDG., 583 Yangcheon-ro, Gangseo-gu, Seoul, Korea 07547 2Dept. of Materials science and chemical engineering, Hanyang University, 55 Hanyangdaehak-ro, Sangnok-gu, Ansan-si, Gyeonggi-do, Korea 15588

DOI : 10.5695/JKISE.2021.54.3.158

Abstract

Some studies on electrochemical additive manufacturing of metals were summarized in this technical report, and development status of selective electrochemical 3D printing technology was introduced. In order to apply it to the PCB mass production process, essential considerations how to overcome the fundamental problems, such as the sizing, process sequence and PCB process design have been described.

Keywords

Copper, 3D printing, electroplating package