저널

Ag-coated Cu dendrites were prepared as a filler for an electromagnetic interference shielding application. Ag layers on the Cu dendrites was coated by two approaches. One is a direct autocatalytic plating with a reducing agent. The other approach was achieved by two-step plating, a galvanic displacement reaction to form Ag seed layers on Cu following by an autocatalytic plating with a reducing agent. The procedure-dependent average particle size and tap density of Ag-coated Cu dendrites were characterized. The electrical resistance and electromagnetic interference shielding effect (EMI SE) were analyzed with the Ag-coated Cu dendrites prepared in the two approaches. Additionally, the content of the Ag coated on Cu dendrites was controlled from 2% to 20%. The electrical resistance and EMI SE were critically determined by Ag contents coated on Cu.

Electromagnetic interference shielding;Ag-coated Cu particle;Galvanic displacement;