한국표면공학회지 (50권4호 244-250)
Effect of Plating Conditions on Electroless Copper Plating on SiC Fabric
직조된 SiC 섬유에 무전해 구리도금 시 도금 조건의 영향
이기환;손유한;한태양;이경진;김혜성;한준현;
Lee, Kee Hwan;Sohn, Youhan;Han, Taeyang;Lee, Kyung Jin;Kim, Hye Hung;Han, Jun Hyun;
충남대학교 신소재공학과;충남대학교 응용화학공학과;부산대학교 나노메카트로닉스공학과;
Department of Materials Science & Engineering, Chungnam National University;Department of Chemical Engineering & Applied Chemistry, Chungnam National University;Department of Nanomechatronics Engineering, Pusan National University;
Effects of plating conditions (dispersant concentration, plating time, and ultrasonication) on electroless Cu plating on SiC fabric woven by crossing of SiC continuous fibers vertically were studied. The ultrasonic dispersion treatment not only did not improve the dispersion of the SiC fibers, but also did not change the plating thickness. The ultrasonication in the pretreatment step of electroless plating did not improve the dispersion of the fibers, while the ultrasonication in the plating step enhanced the dispersion of the fibers and decreased the thickness of the Cu films. It was possible to control the thickness of the Cu coating layer as well as the dispersion of the fibers in the fabric by changing the plating conditions such as dispersant concentration, plating time, and ultrasonication, but it was very difficult to coat copper on the intersection of vertical fibers in the fabric.
SiC fabric;Copper coating;Electroless plating;Ultrasonication;Dispersant;
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