한국표면공학회지 (50권3호 177-182)
Effect of Surfactant in Electroless Ni-B Plating for Coating on the Diamond Powder
다이아몬드 분말상에 무전해 Ni-B 도금을 위한 계면활성제의 영향
양창열;유시영;문환균;이정호;유봉영;
Yang, Changyol;Yu, Si-Young;Moon, Hwan-Gyun;Lee, Jung-Ho;Yoo, Bongyoung;
한양대학교 첨단신소재공학과;일진다이아몬드;한양대학교 첨단신소재공학과재료화학공학과;
Department of Materials and Chemical Engineering, Hanyang University;Iljin Diamond Co., Ltd.;
The properties of electroless Ni-B thin film on diamond powder with different parameters (temperature, pH, surfactant etc.) were studied. The surface morphology, structure and composition distribution of the Ni-B film were observed by field effect scanning electron microscope (FE-SEM), energy-dispersive spectrometer (EDS), X-ray diffraction (XRD) and Auger electron spectroscopy (AES). The growth rate of Ni-B film was increased with increase of bath temperature. The B content in Ni-B film was reduced with increase of bath pH. As a result the structure of Ni-B film was changed from amorphous to crystalline structure. The PVP in solution plays multi-functional roles as a dispersant and a stabilizer. The Ni-B film deposited with adding 0.1 mM-PVP was strongly introduced an amorphous structure with higher B content (25 at.%). Also the crystallite size of Ni-B film was reduced from 12.7 nm to 5.4 nm.
Diamond wire saw;Diamond powder;Electroless deposition;Reducing agent;Complexing agent;Dispersant;Surfactant etc;
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