저널

Expensive silver powder is used to form electrodes in most IT equipment, and recently, many attempts have been made to lower manufacturing costs by developing powders with Ag-Ni or Ag-Cu core-shell structures. This study examined the sintering behavior of Ag-Ni electrode powder with a core-shell structure for silicon solar cell with high energy efficiency. The electrode powder was found to have a surface similar to pure Ag powder, and cross-sectional analysis revealed that Ag was uniformly coated on Ni powder. Each electrode was formed by sintering in the range of $500^{circ}C$ to $800^{circ}C$, and the specimen sintered at $600^{circ}C$ had the lowest sheet resistance of $5.5m{Omega}/{Box}$, which is about two times greater than that of pure Ag. The microstructures of electrodes formed at varying sintering temperatures were examined to determine why sheet resistance showed a minimum value at $600^{circ}C$. The electrode formed at $600^{circ}C$ had the best Ag connectivity, and thus provided a better path for the flow of electrons.

Core-shell;Silver;Nickel;Electrode;Sintering;