한국표면공학회지 (49권4호 368-375)
MoN-Cu Thin Films Deposited by Magnetron Sputtering with Single Alloying Target
단일 합금타겟을 이용한 마크네트론 스퍼터링 공정으로 증착된 MoN-Cu 박막
이한찬;문경일;신백균;
Lee, Han-Chan;Moon, Kyoung-Il;Shin, Paik-Kyun;
인하대학교 전기공학과;한국생산기술연구원 열처리그룹;
Department of Electrical Engineering, Inha University;Korea Institute of Industrial Technology, Heat Treatment R&BD Group;
MoN-Cu thin films were prepared to achieve appropriate properties of high hardness and low friction coefficient, which could be applied to automobile engine parts for reducing energy consumption as well as solving wear problems. Composite thin films of MoN-Cu have been deposited by various processes using multiple targets such as Mo and Cu. However, those deposition with multiple targets revealed demerits such as difficulties in exact control of composition and homogeneous deposition. This study is aiming for suggesting an appropriate process to solve those problems. A single alloying target of Mo-Cu (10 at%) was prepared by powder metallurgy methods of mechanical alloying (MA) and spar plasma sintering (SPS). Thin film of MoN-Cu was then deposited by magnetron sputtering using the single alloying target of Mo-Cu (10 at%). Properties of the resulting MoN-Cu thin film were examined and compared to those of MoN-Cu thin films prepared with double targets of Mo and Cu.
MoN-Cu thin films;Single alloying target;Magnetron sputtering;MA;SPS;