Korean Institute of Surface Engineering

pISSN : 1225-8024 | eISSN : 3399-8403


공학

한국표면공학회지 (48권6호 260-268)

Effect of Heat Treatment on Interface Behavior in Ni-P/Cr Double Layer

열처리 시간에 따른 Ni-P/Cr 이중 도금 층의 계면 거동에 관한 연구

최명희;박영배;이병호;변응선;이규환;
Choi, Myung-Hee;Park, Young-Bae;Rhee, Byong-ho;Byon, Eungsun;Lee, Kyu Hwan;

한국기계연구원 부설 재료 연구소 표면기술연구본부;국립안동대학교 신소재공학부 청정에너지소재기술연구센터;주식회사 비츠로테크;
Surface Technology Division, Korea Institute of Materials Science;School of Materials Science and Engineering, Andong National University;VITZROTECH Co., Ltd.;

DOI : 10.5695/JKISE.2015.48.6.260

Abstract

The thermal barrier coating (TBC) for inner wall of liquid-fuel rocket combustor consists of NiCrAlY as bonding layer and $ZrO_2$ as a top layer. In most case, the plasma spray coating is used for TBC process and this process has inherent possibility of cracking due to large difference in thermal expansion coefficients among bonding layer, top layer and metal substrate. In this paper, we suggest crack-free TBC process by using a precise electrodeposition technique. Electrodeposited Ni-P/Cr double layer has similar thermal expansion coefficient to the Cu alloy substrate resulting in superior thermal barrier performance and high temperature oxidation resistance. We studied the effects of phosphorous concentrations (2.12 wt%, 6.97 wt%, and 10.53 wt%) on the annealing behavior ($750^{circ}C$) of Ni-P samples and Cr double layered electrodeposits. Annealing temperature was simulated by combustion test condition. Also, we conducted SEM/EDS and XRD analysis for Ni-P/Cr samples. The results showed that the band layers between Ni-P and Cr are Ni and Cr, and has no formed with heat treatment. These band layers were solid solution of Cr and Ni which is formed by interdiffusion of both alloy elements. In addition, the P was not found in it. The thickness of band layer was increased with increasing annealing time. We expected that the band layer can improve the adhesion between Cr and Ni-P.

Keywords

Inner Wall of Liquid-fuel Rocket Combustor;Thermal Barrier Coating;Electrodeposition;Ni-P/Cr;Annealing;Band Layer;