한국표면공학회지 (47권4호 162-167)
Effect of Complexing Agents on Adhesion Strength between Electroless Copper Film and Ta Diffusion Barrier
무전해 구리 도금액에서 착화제가 접합력에 미치는 영향에 대한 고찰
이창면;전준미;허진영;이홍기;
Lee, Chang-Myeon;Jeon, Jun-Mi;Hur, Jin-Young;Lee, Hong-Kee;
한국생산기술연구원 표면처리연구실용화그룹;
Surface Technology R &BD Group, Korea Institute of Industrial Technology;
The primary purpose of this research is to investigate how much the complexing agent in electroless Cu electrolytes will affect adhesion strength between copper film and Ta diffusion barrier for Cu interconnect of semiconductor. The adhesion strength using rochelle`s salt as complexing agent was higher than the case of using EDTA-4Na. Effect of complexing agent on adhesion strength and electrical resistivity was studied in crystal structural point of view.
Electroless copper;Adhesion strength;Residual stress;Electrical resistivity;Complexing agent;
PDF