Korean Institute of Surface Engineering

pISSN : 1225-8024 | eISSN : 3399-8403


공학

한국표면공학회지 (47권3호 128-136)

Study of Etching Method for Plating Layer Formation of ABS Resin

ABS 수지상의 도금층 형성을 위한 에칭 방법 연구

최경수;최기덕;신현준;이상기;최순돈;
Choi, Kyoung Su;Choi, Ki Duk;Shin, Hyun Jun;Lee, Sang-Ki;Choi, Soon Don;

영남대학교 신소재 공학부;영남이공대학 기계공학과;가야대학교 보석디자인학과;
School of Materials Science and Engineering, Yeungnam University;Division of mechanical engineering technology, yeungnam collage of science&technology;Department of Gem Design Kaya University;

DOI : 10.5695/JKISE.2014.47.3.128

Abstract

In the present study, we successfully developed an eco-friendly chemical etching solution and proper condition for plating on ABS material. The mechanism of forming Ni plating layer on ABS substrate is known as following. In general, the etching solution used for the etching process is a solution of chromic acid and sulfuric acid. The etching solution is given to the surface resulting in elution of butadiene group, so-called anchor effect. Such a rough surface can easily adsorb catalyst resulting in the increase of adhesion between ABS substrate and Ni plating layer. However a use of chromic acid is harmful to environment. It is, therefore, essential to develop a new alternative solution. In the present study, we proposed an eco-friendly etching solution composed of potassium permanganate, sulfuric acid and phosphoric acid. This solution was testified to observe the surface microstructure and the pore size of electrical Ni plating layer, and the adhesive correlation between deposited layers fabricated by electro Ni plating was confirmed. The result of the present study, the newly developed, eco-friendly etching solution, which is a mixture of potassium permanganate 25 g/L, sulfuric acid 650ml/L and phosphoric acid 250ml/L, has a similar etching effect and adhesion property, compared with the commercially used chromium acid solution in the condition at $70^{circ}C$ for 5 min.

Keywords

ABS resin;Etch;Chrome free;Electro plating;Surface treatment;Anchoring effect;Butadiene;