한국표면공학회지 (45권2호 75-80)
High Rate Deposition System by Inductively Coupled Plasma Assisted Sputter-sublimation
유도 결합 플라즈마 스퍼터 승화법을 이용한 고속증착 시스템
최지성;주정훈;
Choi, Ji-Sung;Joo, Jung-Hoon;
군산대학교 공과대학 신소재공학과, 플라즈마 소재 응용 센터;
Department of Materials Science and Engineering, Plasma Materials Research Center Kunsan National University;
A sputter-sublimation source was tested for high rate deposition of protective coating of PEMFC(polymer electrolyte membrane fuel cell) with high electrical conductivity and anti-corrosion capability by DC biasing of a metal rod immersed in inductively coupled plasma. A SUS(stainless steel) tube, rod were tested for low thermal conductivity materials and copper for high thermal conductivity ones. At 10 mTorr of Ar ICP(inductively coupled plasma) with 2.4 MHz, 300 W, the surface temperature of a SUS rod reached to
High rate sputtering;Sublimation;Inductively coupled plasma;