Korean Institute of Surface Engineering

pISSN : 1225-8024 | eISSN : 3399-8403


공학

한국표면공학회지 (45권2호 75-80)

High Rate Deposition System by Inductively Coupled Plasma Assisted Sputter-sublimation

유도 결합 플라즈마 스퍼터 승화법을 이용한 고속증착 시스템

최지성;주정훈;
Choi, Ji-Sung;Joo, Jung-Hoon;

군산대학교 공과대학 신소재공학과, 플라즈마 소재 응용 센터;
Department of Materials Science and Engineering, Plasma Materials Research Center Kunsan National University;

DOI : 10.5695/JKISE.2012.45.2.075

Abstract

A sputter-sublimation source was tested for high rate deposition of protective coating of PEMFC(polymer electrolyte membrane fuel cell) with high electrical conductivity and anti-corrosion capability by DC biasing of a metal rod immersed in inductively coupled plasma. A SUS(stainless steel) tube, rod were tested for low thermal conductivity materials and copper for high thermal conductivity ones. At 10 mTorr of Ar ICP(inductively coupled plasma) with 2.4 MHz, 300 W, the surface temperature of a SUS rod reached to $1,289^{circ}C$ with a dc bias of 150 W (-706 V, 0.21 A) in 2 mins. For 10 min of sputter-sublimation, 0.1 gr of SUS rod was sputter-sublimated which is a good evidence of a high rate deposition source. ICP is used for sputter-sublimation of a target material, for substrate pre-treatment, film quality improvement by high energy particle bombardment and reactive deposition.

Keywords

High rate sputtering;Sublimation;Inductively coupled plasma;