한국표면공학회지 (41권1호 23-27)
The Effect of Solution Agitation on the Electroless Cu Deposition Within Nano-patterns
용액 교반이 미세 패턴 내 무전해 구리 도금에 미치는 영향
이주열;김만;김덕진;
Lee, Joo-Yul;Kim, Man;Kim, Deok-Jin;
한국기계연구원 부설 재료연구소 표면기술연구부;선문대학교 신소재 공학과;
Department of Surface Technology, Korea of Materials Science;Electronic Materials Engineering, Sunmoon University;
The effect of solution agitation on the copper electroless deposition process of ULSI (ultra large scale integration) interconnections was investigated by using physical, electrochemical and electrical techniques. It was found that proper solution agitation was effective to obtain superconformal copper configuration within the trenches of
ULSI;Elecroless deposition;Superconformal copper filling;