Korean Institute of Surface Engineering

pISSN : 1225-8024 | eISSN : 3399-8403

공학

한국표면공학회지 (36권3호 263-271)

Electroless Ni-P layer Characteristics in accordance with the plating process conditions

무전해 Ni-P 도금의 공정조건에 따른 도금피막 특성변화

이홍기;전준미;박해덕;
Lee Hong-Kee;Jeon Jun-Mi;Park Hae-Duck;

한국생산기술연구원;해송P&C;
Korea Institute Of Industrial Technology;Hae Song P&C;

Abstract

Optimal conditions of electroless nickel plating in acid baths has been studied for industrial applications of a developed EN solution. The phosphorus content in the deposition ranges from 8 to $12;wt.\%$. The investigated EN plating parameters are ion concentrations of nickel and hypophosphite, concentration of reducing and complexing agent, temperature, and pH. The average plating rate of Ni-P deposition was ca. $14{mu}m/h$. The EN solution used shows a deposition rate of $10{mu}m/h$ up to seven metal turnovers.

Keywords

Electroless Ni-P;Hypophosphite;Plating conditions;Metal turnover;