Korean Institute of Surface Engineering

pISSN : 1225-8024 | eISSN : 3399-8403


공학

한국표면공학회지 (36권3호 242-250)

Study on Nickel Plating of Leadframe using Pulse Technique

펄스법을 이용한 리드프레임의 니켈도금에 관한 연구

정원섭;민병승;임종주;정우창;
Chung W.S.;Min B.S.;Lim J.J.;Chung U.C.;

부산대학교 공과대학 재료공학부;
Div. material science & engineering, Pusan National University;

Abstract

Electrodeposition of Ni was carried out on copper substrate from Ni Sulfamate bath by DC and high frequency pulse current. During the electroplating, bath temperature was steady $60^{circ}C$ , agitation was applied. Morphology and surface roughness of electrodeposits was investigated with the AFM. Crystalline structure of electrodeposits was investigated with XRD. Also, surface electric resistivity was investigated with 4-point probe. The result of crystalline structure by X-ray diffractometer, in the case of DC, <200> direction was dominant growing direction. But in the case of PC, the ratio of <200> direction vs. other direction decreased. As the pulse frequency increased, the enhanced properties of deposits were shown. With increasing frequency, the degree of surface properties increased DC more than that of PC, eg surface morphology, roughness and the degree of compactness of grains. With increasing duty cycle, the surface properties such as the degree of the morphology, roughness and electroconductivity was deteriorated.

Keywords

Pulse Ni plating;frequency;duty cycle;Leadframe;